IS25LP016D-RGLA1 vs SST26VF016-80-5C-QAF feature comparison

IS25LP016D-RGLA1 Integrated Silicon Solution Inc

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SST26VF016-80-5C-QAF Microchip Technology Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC MICROCHIP TECHNOLOGY INC
Package Description TBGA, 5 X 6 MM, ROHS COMPLIANT, WSON-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 133 MHz 80 MHz
JESD-30 Code R-PBGA-B24 R-XDSO-N8
Length 8 mm 6 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 24 8
Number of Words 2097152 words 16777216 words
Number of Words Code 2000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX8 16MX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TBGA HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 2.7 V
Screening Level AEC-Q100
Seated Height-Max 1.2 mm 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL NO LEAD
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm 5 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SON
Pin Count 8
JESD-609 Code e4
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 40

Compare IS25LP016D-RGLA1 with alternatives

Compare SST26VF016-80-5C-QAF with alternatives