IS25LP016D-RGLE vs IS25LQ016-JVA1 feature comparison

IS25LP016D-RGLE Integrated Silicon Solution Inc

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IS25LQ016-JVA1 Integrated Silicon Solution Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TBGA, 0.150 INCH, LEAD FREE, VVSOP-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 133 MHz 104 MHz
JESD-30 Code R-PBGA-B24 R-PDSO-G8
Length 8 mm 4.9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 8
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA VSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Seated Height-Max 1.2 mm 0.88 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Type NOR TYPE NOR TYPE
Width 6 mm 3.9 mm
Base Number Matches 1 1
Rohs Code No
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code TSOP8,.25
Qualification Status Not Qualified
Screening Level AEC-Q100
Serial Bus Type QSPI
Standby Current-Max 0.00003 A
Supply Current-Max 0.02 mA
Write Protection HARDWARE/SOFTWARE

Compare IS25LP016D-RGLE with alternatives

Compare IS25LQ016-JVA1 with alternatives