IS25LQ016B-JWLE
vs
IS25LQ016B-JHLA2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Package Description |
Die, Die Or Chip
|
Tbga, Bga24,4x6,40
|
| Reach Compliance Code |
Unknown
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
104 Mhz
|
104 Mhz
|
| Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
X-XUUC-N
|
R-PBGA-B24
|
| Memory Density |
16777216 Bit
|
16777216 Bit
|
| Memory IC Type |
Flash
|
Flash
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Words |
2097152 Words
|
2097152 Words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2mx8
|
2mx8
|
| Package Body Material |
Unspecified
|
Plastic/Epoxy
|
| Package Code |
DIE
|
TBGA
|
| Package Equivalence Code |
DIE OR CHIP
|
BGA24,4X6,40
|
| Package Shape |
Unspecified
|
Rectangular
|
| Package Style |
Uncased Chip
|
Grid Array, Thin Profile
|
| Parallel/Serial |
Serial
|
Serial
|
| Programming Voltage |
3 V
|
3 V
|
| Serial Bus Type |
Qspi
|
Qspi
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Form |
No Lead
|
Ball
|
| Terminal Position |
Upper
|
Bottom
|
| Type |
Nor Type
|
Nor Type
|
| Write Protection |
Hardware/Software
|
Hardware/Software
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Length |
|
8 Mm
|
| Number of Terminals |
|
24
|
| Peak Reflow Temperature (Cel) |
|
Not Specified
|
| Screening Level |
|
Aec-Q100
|
| Seated Height-Max |
|
1.2 Mm
|
| Terminal Pitch |
|
1 Mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
Not Specified
|
| Width |
|
6 Mm
|
|
|
|