IS25LQ040B-JDLA3
vs
IS25LQ040B-JDLE
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Package Description |
Tssop-8
|
Tssop,
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
104 Mhz
|
104 Mhz
|
| Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Length |
4.4 Mm
|
4.4 Mm
|
| Memory Density |
4194304 Bit
|
4194304 Bit
|
| Memory IC Type |
Flash
|
Flash
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
524288 Words
|
524288 Words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512kx8
|
512kx8
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.25
|
TSSOP8,.25
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Thin Profile, Shrink Pitch
|
Small Outline, Thin Profile, Shrink Pitch
|
| Parallel/Serial |
Serial
|
Serial
|
| Peak Reflow Temperature (Cel) |
Not Specified
|
|
| Programming Voltage |
3 V
|
3 V
|
| Screening Level |
Aec-Q100
|
|
| Seated Height-Max |
1.2 Mm
|
1.2 Mm
|
| Serial Bus Type |
Qspi
|
Qspi
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Automotive
|
Industrial
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
0.65 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
Not Specified
|
|
| Type |
Nor Type
|
Nor Type
|
| Width |
3 Mm
|
3 Mm
|
| Write Protection |
Hardware/Software
|
Hardware/Software
|
| Base Number Matches |
1
|
1
|
|
|
|