IS27HC010-70PL vs AM27X010-70JI feature comparison

IS27HC010-70PL Integrated Silicon Solution Inc

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AM27X010-70JI Spansion

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC SPANSION INC
Part Package Code QFJ QFJ
Package Description PLASTIC, LCC-32 HQCCJ,
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 55 ns
I/O Type COMMON
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0
Length 13.97 mm 13.9 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8 64KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ HQCCJ
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.55 mm 3.5 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.4 mm
Base Number Matches 2 1

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Compare AM27X010-70JI with alternatives