IS27HC010-70PL vs AT27C010-70PI feature comparison

IS27HC010-70PL Integrated Silicon Solution Inc

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AT27C010-70PI Atmel Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC ATMEL CORP
Part Package Code QFJ DIP
Package Description PLASTIC, LCC-32 0.600 INCH, PLASTIC, DIP-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-PQCC-J32 R-PDIP-T32
JESD-609 Code e0 e0
Length 13.97 mm 42.037 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC32,.5X.6 DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.55 mm 4.826 mm
Standby Current-Max 0.00005 A 0.00001 A
Supply Current-Max 0.03 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 11.43 mm 15.24 mm
Base Number Matches 2 1
Samacsys Manufacturer Microchip
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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