IS42S16160J-7BL vs ECS2516AFCN-A-Y3 feature comparison

IS42S16160J-7BL Integrated Silicon Solution Inc

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ECS2516AFCN-A-Y3 Elpida Memory Inc

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC ELPIDA MEMORY INC
Package Description TFBGA, DIE,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.24 8542.32.00.24
Factory Lead Time 8 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc.
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5.4 ns 5.4 ns
Additional Feature PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code S-PBGA-B54 R-XUUC-N
JESD-609 Code e1
Length 8 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 54
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 16MX16 16MX16
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TFBGA DIE
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH UNCASED CHIP
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL NO LEAD
Terminal Pitch 0.8 mm
Terminal Position BOTTOM UPPER
Width 8 mm
Base Number Matches 1 1
Part Package Code DIE
Qualification Status Not Qualified

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Compare ECS2516AFCN-A-Y3 with alternatives