K5A3340YBC-T7550 vs IS71V16F32CS08-7070BI feature comparison

K5A3340YBC-T7550 Samsung Semiconductor

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IS71V16F32CS08-7070BI Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description TFBGA, 8 X 11.60 MM, 0.80 MM PITCH, MINI, BGA-73
Pin Count 69 73
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANIZED AS 512K X 8 / 256K X 16; NOR FLASH CAN ALSO BE ORGANIZED AS 4M X 8 ALSO CONTAINS 512K X 16/1M X 8 SRAM
JESD-30 Code R-PBGA-B69 R-PBGA-B73
Length 11 mm 11.6 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 69 73
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Access Time-Max 70 ns
JESD-609 Code e0
Mixed Memory Type FLASH+SRAM
Package Equivalence Code BGA73,10X12,32
Standby Current-Max 0.000005 A
Supply Current-Max 0.053 mA
Terminal Finish TIN LEAD

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Compare IS71V16F32CS08-7070BI with alternatives