KFG1G16Q2C-DEB60
vs
AM29PDL640G83WHI
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
VFBGA, BGA63,10X12,32
|
TFBGA, BGA63,8X12,32
|
Pin Count |
63
|
63
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
76 ns
|
85 ns
|
Boot Block |
BOTTOM
|
BOTTOM/TOP
|
Clock Frequency-Max (fCLK) |
66 MHz
|
|
Command User Interface |
YES
|
YES
|
Data Polling |
NO
|
YES
|
JESD-30 Code |
R-PBGA-B63
|
R-PBGA-B63
|
Length |
13 mm
|
12 mm
|
Memory Density |
17179869184 bit
|
67108864 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
1K
|
16,126
|
Number of Terminals |
63
|
63
|
Number of Words |
1073741824 words
|
4194304 words
|
Number of Words Code |
1000000000
|
4000000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-40 °C
|
Organization |
1GX16
|
4MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
TFBGA
|
Package Equivalence Code |
BGA63,10X12,32
|
BGA63,8X12,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Page Size |
1K words
|
8 words
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
1.8 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Sector Size |
64K
|
4K,32K
|
Standby Current-Max |
0.00005 A
|
0.000005 A
|
Supply Current-Max |
0.04 mA
|
0.045 mA
|
Supply Voltage-Max (Vsup) |
1.95 V
|
3.1 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Toggle Bit |
NO
|
YES
|
Type |
SLC NAND TYPE
|
NOR TYPE
|
Width |
10 mm
|
11 mm
|
Write Cycle Time-Max (tWC) |
0.00007 ms
|
|
Base Number Matches |
1
|
2
|
Common Flash Interface |
|
YES
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare KFG1G16Q2C-DEB60 with alternatives
Compare AM29PDL640G83WHI with alternatives