KSZ9031RNXCC
vs
VSC7421XJQ-04
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVQCCN,
|
HTFQFP, TQFP302,1SQ
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
5A991.C
|
| HTS Code |
8517.70.00.00
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Date Of Intro |
2016-03-14
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Data Rate |
1000000 Mbps
|
|
| JESD-30 Code |
S-XQCC-N48
|
S-PQFP-G302
|
| JESD-609 Code |
e3
|
|
| Length |
7 mm
|
24 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
302
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HTFQFP
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
TQFP302,1SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Nom |
1.2 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7 mm
|
24 mm
|
| Base Number Matches |
2
|
1
|
| Supply Current-Max |
|
2.6 mA
|
|
|
|
Compare KSZ9031RNXCC with alternatives
Compare VSC7421XJQ-04 with alternatives