LM158FKB
vs
TLV2464CPW
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QLCC
|
TSSOP
|
| Package Description |
HERMETIC SEALED, CERAMIC, LCC-20
|
GREEN, PLASTIC, TSSOP-14
|
| Pin Count |
20
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.3 µA
|
0.025 µA
|
| Common-mode Reject Ratio-Nom |
80 dB
|
80 dB
|
| Input Offset Voltage-Max |
7000 µV
|
2200 µV
|
| JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G14
|
| Length |
8.89 mm
|
5 mm
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Functions |
2
|
4
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Seated Height-Max |
2.03 mm
|
1.2 mm
|
| Slew Rate-Nom |
0.3 V/us
|
1.6 V/us
|
| Supply Voltage Limit-Max |
32 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
NOT SPECIFIED
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
700
|
5200
|
| Width |
8.89 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e4
|
|
|
|
Compare LM158FKB with alternatives
Compare TLV2464CPW with alternatives