M24LR16E-RUW20/2
vs
BR24G16FJ-3AE2
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
ROHM CO LTD
|
| Package Description |
DIE,
|
LSOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
0.4 MHz
|
1 MHz
|
| JESD-30 Code |
X-XUUC-N
|
R-PDSO-G8
|
| Memory Density |
16384 bit
|
16384 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
32
|
8
|
| Number of Functions |
1
|
1
|
| Number of Words |
512 words
|
2048 words
|
| Number of Words Code |
512
|
2000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512X32
|
2KX8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
LSOP
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE, LOW PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Serial Bus Type |
I2C
|
I2C
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
SEATED HT-CALCULATED AND IT ALSO OPERATES AT 1.6V WITH 400KHZ
|
| Length |
|
4.9 mm
|
| Number of Terminals |
|
8
|
| Seated Height-Max |
|
1.65 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
3.9 mm
|
|
|
|
Compare M24LR16E-RUW20/2 with alternatives
Compare BR24G16FJ-3AE2 with alternatives