M25P32-VME6 vs XC17512LPD8C feature comparison

M25P32-VME6 Micron Technology Inc

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XC17512LPD8C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC XILINX INC
Part Package Code DFP DIP
Package Description HVSON, PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 50 MHz 15 MHz
JESD-30 Code R-XDSO-N8 R-PDIP-T8
JESD-609 Code e0 e0
Length 8 mm 9.3599 mm
Memory Density 33554432 bit 524288 bit
Memory IC Type FLASH CONFIGURATION MEMORY
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 4194304 words 524288 words
Number of Words Code 4000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4MX8 512KX1
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVSON DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 4.5974 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 6 mm 7.62 mm
Base Number Matches 10 2
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
I/O Type COMMON
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Time@Peak Reflow Temperature-Max (s) 30

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