M25PE10VMP3TP
vs
MX25L8005M2C-15
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Package Description |
6 X 5 Mm, Rohs Compliant, Vfqfp-8
|
Sop, Sop8,.3
|
| Reach Compliance Code |
Compliant
|
Unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
75 Mhz
|
33 Mhz
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
| Length |
6 Mm
|
5.28 Mm
|
| Memory Density |
1048576 Bit
|
8388608 Bit
|
| Memory IC Type |
Flash
|
Flash
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
131072 Words
|
1048576 Words
|
| Number of Words Code |
128000
|
1000000
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128kx8
|
1mx8
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
HVSON
|
SOP
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Heat Sink/Slug, Very Thin Profile
|
Small Outline
|
| Parallel/Serial |
Serial
|
Serial
|
| Programming Voltage |
2.7 V
|
3.3 V
|
| Seated Height-Max |
1 Mm
|
2.16 Mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3.3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Automotive
|
Commercial
|
| Terminal Form |
No Lead
|
Gull Wing
|
| Terminal Pitch |
1.27 Mm
|
1.27 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Type |
Nor Type
|
Nor Type
|
| Width |
5 Mm
|
5.23 Mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Endurance |
|
100000 Write/Erase Cycles
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
SOP8,.3
|
| Qualification Status |
|
Not Qualified
|
| Serial Bus Type |
|
Spi
|
| Standby Current-Max |
|
0.00001 A
|
| Supply Current-Max |
|
0.015 Ma
|
| Terminal Finish |
|
Tin Lead
|
| Write Protection |
|
Hardware/Software
|
|
|
|