M38510/65005BCA vs 74HC03DB,118 feature comparison

M38510/65005BCA QP Semiconductor

Buy Now

74HC03DB,118 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code DIP SSOP1
Package Description DIP, SOT-337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 149.35
CO2e (mg) 20219.441 1851.94
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 29 ns 29 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT337-1
Length 6.2 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Package Equivalence Code SSOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Schmitt Trigger NO
Seated Height-Max 2 mm
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

Compare M38510/65005BCA with alternatives

Compare 74HC03DB,118 with alternatives