M38510/65005BCA vs 74HC03DB,118 feature comparison

M38510/65005BCA Defense Supply Center Columbus

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74HC03DB,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer DEFENSE SUPPLY CENTER COLUMBUS NXP SEMICONDUCTORS
Part Package Code DIP SSOP1
Package Description DIP, DIP14,.3 SSOP, SSOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 29 ns 29 ns
Propagation Delay (tpd) 29 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) - hot dipped NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 4 2
Source Content uid 74HC03DB,118
Rohs Code Yes
Manufacturer Package Code SOT337-1
Length 6.2 mm
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

Compare M38510/65005BCA with alternatives

Compare 74HC03DB,118 with alternatives