M95640-RDL3G vs X24645SM feature comparison

M95640-RDL3G STMicroelectronics

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X24645SM Xicor Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS XICOR INC
Part Package Code TSSOP
Package Description 0.169 INCH, TSSOP-14 PLASTIC, SOIC-14
Pin Count 14
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 2 MHz 0.1 MHz
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 5 mm 8.65 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 14 14
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.75 mm
Serial Bus Type SPI I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 4.5 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 3.9 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 4
Additional Feature 2 WIRE SERIAL INTERFACE
Output Characteristics OPEN-DRAIN

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