M95M02-DRCS6TP/K
vs
M95M02-DRCS6P/K
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Package Description |
Wlcsp-8
|
Vfbga, Bga8(Unspec)
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
3A991.B.1.B.1
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Factory Lead Time |
12 Weeks
|
|
| Clock Frequency-Max (fCLK) |
5 Mhz
|
5 Mhz
|
| Command User Interface |
No
|
No
|
| Data Polling |
No
|
No
|
| Data Retention Time-Min |
200
|
200
|
| Endurance |
4000000 Write/Erase Cycles
|
4000000 Write/Erase Cycles
|
| JESD-30 Code |
R-XBGA-B8
|
R-XBGA-B8
|
| Length |
3.556 Mm
|
3.556 Mm
|
| Memory Density |
2097152 Bit
|
2097152 Bit
|
| Memory IC Type |
Eeprom
|
Eeprom
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
262144 Words
|
262144 Words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
Synchronous
|
Synchronous
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256kx8
|
256kx8
|
| Output Characteristics |
3-State
|
3-State
|
| Package Body Material |
Unspecified
|
Unspecified
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA8(UNSPEC)
|
BGA8(UNSPEC)
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Grid Array, Very Thin Profile, Fine Pitch
|
Grid Array, Very Thin Profile, Fine Pitch
|
| Page Size |
256 Words
|
256 Words
|
| Parallel/Serial |
Serial
|
Serial
|
| Peak Reflow Temperature (Cel) |
260
|
Not Specified
|
| Programming Voltage |
2.5 V
|
2.5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Pinout |
No
|
No
|
| Seated Height-Max |
0.58 Mm
|
0.58 Mm
|
| Serial Bus Type |
Spi
|
Spi
|
| Standby Current-Max |
0.000003 A
|
0.000003 A
|
| Supply Current-Max |
0.003 Ma
|
0.003 Ma
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Form |
Ball
|
Ball
|
| Terminal Position |
Bottom
|
Bottom
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
Not Specified
|
| Toggle Bit |
No
|
No
|
| Width |
2.011 Mm
|
2.011 Mm
|
| Write Cycle Time-Max (tWC) |
10 Ms
|
10 Ms
|
| Write Protection |
Hardware/Software
|
Hardware/Software
|
| Base Number Matches |
1
|
1
|
|
|
|