MAX1112EAP+
vs
ADC08038CIWM/NOPB
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Part Package Code |
SSOP
|
SOIC
|
| Package Description |
Ssop, Ssop20,.3
|
Sop, Sop20,.4
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
2.048 V
|
5 V
|
| Analog Input Voltage-Min |
-2.048 V
|
|
| Conversion Time-Max |
55 µS
|
8 µS
|
| Converter Type |
Adc, Successive Approximation
|
Adc, Successive Approximation
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7.2 Mm
|
12.8 Mm
|
| Linearity Error-Max (EL) |
0.1953%
|
0.4%
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Analog In Channels |
8
|
8
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY
|
| Output Format |
Serial
|
Serial
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
SSOP
|
SOP
|
| Package Equivalence Code |
SSOP20,.3
|
SOP20,.4
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Shrink Pitch
|
Small Outline
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
0.05 Mhz
|
1 Mhz
|
| Sample and Hold / Track and Hold |
Track
|
Track
|
| Seated Height-Max |
1.99 Mm
|
2.65 Mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Matte Tin
|
Matte Tin (Sn)
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
1.27 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
5.29 Mm
|
7.5 Mm
|
| Base Number Matches |
2
|
1
|
|
|
|