MAX4800CXZ+
vs
MAX4800CXZ
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA, BGA26,8X9,25
|
CSBGA-26
|
Pin Count |
26
|
26
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
R-PBGA-B26
|
R-PBGA-B26
|
JESD-609 Code |
e1
|
|
Length |
6 mm
|
6 mm
|
Moisture Sensitivity Level |
3
|
3
|
Normal Position |
NO
|
NO
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
26
|
26
|
Off-state Isolation-Nom |
77 dB
|
33 dB
|
On-state Resistance Match-Nom |
1.3 Ω
|
1.9 Ω
|
On-state Resistance-Max (Ron) |
38 Ω
|
38 Ω
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA26,8X9,25
|
BGA26,8X9,25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.32 mm
|
1.32 mm
|
Supply Voltage-Max (Vsup) |
13.2 V
|
13.2 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
5000 ns
|
5000 ns
|
Switch-on Time-Max |
5000 ns
|
5000 ns
|
Technology |
BCDMOS
|
BCDMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
5.35 mm
|
5.35 mm
|
Base Number Matches |
4
|
4
|
Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare MAX4800CXZ+ with alternatives
Compare MAX4800CXZ with alternatives