MAX507BCWG
vs
MX7245AQ
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
0.300 INCH, SOIC-24
|
CERAMIC, DIP-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
10 V
|
5 V
|
| Analog Output Voltage-Min |
|
-5 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-PDSO-G24
|
R-CDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15.4 mm
|
|
| Linearity Error-Max (EL) |
0.024%
|
0.0244%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP24,.4
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
5.08 mm
|
| Settling Time-Max |
5 µs
|
5 µs
|
| Supply Current-Max |
12 mA
|
12 mA
|
| Supply Voltage-Nom |
12 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.62 mm
|
| Base Number Matches |
4
|
1
|
| Negative Supply Voltage-Nom |
|
-15 V
|
| Technology |
|
BICMOS
|
|
|
|
Compare MAX507BCWG with alternatives
Compare MX7245AQ with alternatives