MAX5841MEUB+
vs
MAX5841LEUB+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
|
| Part Package Code |
10-MINI_SO-N/A
|
10-MINI_SO-N/A
|
| Package Description |
MINIATURE, MICRO MAX PACKAGE-10
|
|
| Pin Count |
10
|
10
|
| Manufacturer Package Code |
10-MINI_SO-N/A
|
10-MINI_SO-N/A
|
| Reach Compliance Code |
compliant
|
|
| Date Of Intro |
2002-02-21
|
2002-02-21
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Analog Output Voltage-Max |
5 V
|
5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PDSO-G10
|
S-PDSO-G10
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Linearity Error-Max (EL) |
0.3906%
|
0.3906%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Settling Time-Nom (tstl) |
4 µs
|
4 µs
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MAX5841MEUB+ with alternatives
Compare MAX5841LEUB+T with alternatives