MB81464-12P vs TMS4464-12FML feature comparison

MB81464-12P FUJITSU Limited

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TMS4464-12FML Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU LTD TEXAS INSTRUMENTS INC
Part Package Code DIP QFN
Package Description DIP-18 QCCJ, LDCC18,.33X.53
Pin Count 18 18
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Time-Max 120 ns 120 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T18 R-PQCC-J18
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type PAGE MODE DRAM PAGE MODE DRAM
Memory Width 4 4
Number of Terminals 18 18
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX4 64KX4
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP18,.3 LDCC18,.33X.53
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Refresh Cycles 256 256
Supply Current-Max 0.065 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology MOS NMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 4 1
Access Mode PAGE
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Length 12.446 mm
Number of Functions 1
Number of Ports 1
Operating Mode ASYNCHRONOUS
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.53 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.366 mm

Compare MB81464-12P with alternatives

Compare TMS4464-12FML with alternatives