MBM29DL640E90PBT vs S29JL064H90BFI002 feature comparison

MBM29DL640E90PBT FUJITSU Limited

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S29JL064H90BFI002 AMD

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FUJITSU LTD ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description PLASTIC, FBGA-63
Pin Count 63
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Additional Feature CONFIGURABLE AS 8M X 8
Alternate Memory Width 8 8
Boot Block BOTTOM/TOP BOTTOM/TOP
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0
Length 11 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1
Number of Sectors/Size 16,126 16,126
Number of Terminals 63 63
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA63,8X12,32 BGA63,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1.2 mm
Sector Size 8K,64K 8K,64K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.058 mA 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 10 mm
Base Number Matches 3 3

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