MBM29LV160BE-90TN vs M29W160DB90M1F feature comparison

MBM29LV160BE-90TN FUJITSU Limited

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M29W160DB90M1F STMicroelectronics

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC STMICROELECTRONICS
Part Package Code TSOP1 SOIC
Package Description PLASTIC, TSOP1-48 0.525 INCH, PLASTIC, SO-44
Pin Count 48 44
Reach Compliance Code unknown compliant
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G48 R-PDSO-G44
Length 18.4 mm 28.2 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Width 12 mm 13.3 mm
Base Number Matches 2 1
Rohs Code Yes
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE

Compare MBM29LV160BE-90TN with alternatives

Compare M29W160DB90M1F with alternatives