MBM29LV652UE-12PBT vs AM29LV640DU121RWHEN feature comparison

MBM29LV652UE-12PBT Spansion

Buy Now Datasheet

AM29LV640DU121RWHEN AMD

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description PLASTIC, FBGA1-63 TFBGA, BGA63,8X12,32
Pin Count 63 63
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0 e0
Length 11 mm 12 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 10 mm 11 mm
Base Number Matches 3 3
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 128
Package Equivalence Code BGA63,8X12,32
Ready/Busy YES
Sector Size 32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Toggle Bit YES

Compare MBM29LV652UE-12PBT with alternatives

Compare AM29LV640DU121RWHEN with alternatives