MC68030FE20C
vs
NG80960JF3V25
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
INTEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LEAD FREE, CERAMIC, QFP-132
|
QFP,
|
| Pin Count |
132
|
132
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
Intel
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
YES
|
| Clock Frequency-Max |
20 MHz
|
25 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CQFP-G132
|
S-PQFP-G132
|
| JESD-609 Code |
e3
|
|
| Length |
24.13 mm
|
|
| Low Power Mode |
NO
|
YES
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP132,1.2SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.175 mm
|
|
| Speed |
20 MHz
|
25 MHz
|
| Supply Voltage-Max |
5.25 V
|
3.45 V
|
| Supply Voltage-Min |
4.75 V
|
3.15 V
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
24.13 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC68030FE20C with alternatives
Compare NG80960JF3V25 with alternatives