MC9S08SH4MSCR vs MC9S08SH8CTGR feature comparison

MC9S08SH4MSCR NXP Semiconductors

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MC9S08SH8CTGR NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description MS-012AA, SOIC-8 0.65 MM PITCH, TSSOP-20
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 5 MHz
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G8 R-PDSO-G16
Length 5.9 mm 5 mm
Number of I/O Lines 5 14
Number of Terminals 8 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Equivalence Code SOP8,.25 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 512
ROM (words) 4096 8192
ROM Programmability FLASH FLASH
Speed 40 MHz 40 MHz
Supply Current-Max 7.7 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 2.7 V
Supply Voltage-Nom 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.9 mm 4.4 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
ECCN Code 3A991.A.2
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
DAC Channels YES
JESD-609 Code e3
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

Compare MC9S08SH4MSCR with alternatives

Compare MC9S08SH8CTGR with alternatives