MCP4725A0T-E/MAY
vs
MAX5712EUT+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Package Description |
Hvson, Tssop6,.08
|
Lssop,
|
| Pin Count |
6
|
6
|
| Manufacturer Package Code |
DFN-6
|
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
|
| Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A Converter
|
D/A Converter
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
Serial
|
Serial
|
| JESD-30 Code |
S-PDSO-N6
|
R-PDSO-G6
|
| JESD-609 Code |
e4
|
e3
|
| Length |
2 Mm
|
2.9 Mm
|
| Linearity Error-Max (EL) |
0.354%
|
0.3906%
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
HVSON
|
LSSOP
|
| Package Equivalence Code |
TSSOP6,.08
|
|
| Package Shape |
Square
|
Rectangular
|
| Package Style |
Small Outline, Heat Sink/Slug, Very Thin Profile
|
Small Outline, Low Profile, Shrink Pitch
|
| Screening Level |
Ts 16949
|
|
| Seated Height-Max |
0.9 Mm
|
1.45 Mm
|
| Settling Time-Nom (tstl) |
6 µS
|
4 µS
|
| Supply Current-Max |
0.4 Ma
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
Yes
|
Yes
|
| Temperature Grade |
Automotive
|
Industrial
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Matte Tin
|
| Terminal Form |
No Lead
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
0.95 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Width |
2 Mm
|
1.625 Mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
Bicmos
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|