MM74HC00NX
vs
HD74HC00P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
RENESAS ELECTRONICS CORP
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
113 ns
115 ns
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
JESD-609 Code
e4
Length
19.2 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Package Equivalence Code
DIP14,.3
Prop. Delay@Nom-Sup
23 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
5.06 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare MM74HC00NX with alternatives
Compare HD74HC00P with alternatives