MPA1765PC vs XC1765EPD8I feature comparison

MPA1765PC Motorola Semiconductor Products

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XC1765EPD8I Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.78 mm 9.3599 mm
Memory Density 65536 bit 65536 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64KX1 64KX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.45 mm 4.5974 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 8
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code e0
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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