MPC8313VRADDC vs SPC5123YVY400B feature comparison

MPC8313VRADDC NXP Semiconductors

Buy Now Datasheet

SPC5123YVY400B NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516 27 X 27 MM, 2.25 HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TEBGA-516
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks 18 Weeks
Samacsys Manufacturer NXP NXP
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 35 MHz
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e2 e2
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Equivalence Code BGA516,26X26,40 BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 266 MHz 400 MHz
Supply Voltage-Max 1.05 V 1.47 V
Supply Voltage-Min 0.95 V 1.33 V
Supply Voltage-Nom 1 V 1.4 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Address Bus Width 32
External Data Bus Width 32
Screening Level AEC-Q100

Compare MPC8313VRADDC with alternatives

Compare SPC5123YVY400B with alternatives