MPP4204E3
vs
MPL4700
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
R-XBCC-N2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Application |
SWITCHING
|
|
| Breakdown Voltage-Min |
25 V
|
25 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
0.15 pF
|
0.15 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
2 Ω
|
2 Ω
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
X BAND
|
X BAND
|
| JESD-30 Code |
R-XBCC-N2
|
R-XBCC-N2
|
| Minority Carrier Lifetime-Nom |
0.03 µs
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
4
|
| Rohs Code |
|
Yes
|
| Diode Res Test Current |
|
10 mA
|
| JESD-609 Code |
|
e4
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare MPP4204E3 with alternatives
Compare MPL4700 with alternatives