MT29F32G08CBABAWP-IT:B vs MT29F32G08ABAAAWP-IT:AT feature comparison

MT29F32G08CBABAWP-IT:B Micron Technology Inc

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MT29F32G08ABAAAWP-IT:AT Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description LEAD FREE, PLASTIC, TSOP1-48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 20 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48
Length 18.4 mm
Memory Density 34359738368 bit
Memory IC Type FLASH FLASH
Memory Width 8
Number of Functions 1
Number of Sectors/Size 4K
Number of Terminals 48
Number of Words 4294967296 words
Number of Words Code 4000000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 4GX8
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Page Size 4K words
Parallel/Serial PARALLEL
Programming Voltage 3.3 V 3.3 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 1M
Standby Current-Max 0.00005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit NO
Type MLC NAND TYPE SLC NAND TYPE
Width 12 mm
Base Number Matches 1 1
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare MT29F32G08CBABAWP-IT:B with alternatives

Compare MT29F32G08ABAAAWP-IT:AT with alternatives