MT29F8G08ABACAWP:C vs W29N08GVBJAD feature comparison

MT29F8G08ABACAWP:C Micron Technology Inc

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W29N08GVBJAD Winbond Electronics Corp

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description TSSOP, TSSOP48,.8,20 ,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Micron
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48
Length 18.4 mm
Memory Density 8589934592 bit
Memory IC Type FLASH FLASH
Memory Width 8
Number of Functions 1
Number of Sectors/Size 4K
Number of Terminals 48
Number of Words 1073741824 words
Number of Words Code 1000000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1GX8
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size 4K words
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 256K
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit NO
Type SLC NAND TYPE SLC NAND TYPE
Width 12 mm
Base Number Matches 1 1
Programming Voltage 3.3 V

Compare MT29F8G08ABACAWP:C with alternatives

Compare W29N08GVBJAD with alternatives