MT9HTF12872RHZ-80EH1
vs
MT9VDDT12872HIY-335
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
DIMM, DIMM200,24
|
DIMM, DIMM200,24
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.36
|
8542.32.00.36
|
| Access Time-Max |
0.4 ns
|
0.7 ns
|
| Clock Frequency-Max (fCLK) |
400 MHz
|
166 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDMA-N200
|
R-PDMA-N200
|
| Memory Density |
9663676416 bit
|
9663676416 bit
|
| Memory Width |
72
|
72
|
| Number of Terminals |
200
|
200
|
| Number of Words |
134217728 words
|
134217728 words
|
| Number of Words Code |
128000000
|
128000000
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
128MX72
|
128MX72
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIMM
|
DIMM
|
| Package Equivalence Code |
DIMM200,24
|
DIMM200,24
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
8192
|
| Standby Current-Max |
0.063 A
|
|
| Supply Current-Max |
1.89 mA
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
2.5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.6 mm
|
0.6 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
1
|
| Memory IC Type |
|
DDR DRAM MODULE
|
|
|
|
Compare MT9HTF12872RHZ-80EH1 with alternatives
Compare MT9VDDT12872HIY-335 with alternatives