MTFC128GAPALBH-AAT vs MTFC128GAPALBH-AIT feature comparison

MTFC128GAPALBH-AAT Micron Technology Inc

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MTFC128GAPALBH-AIT Micron Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description , TFBGA-153
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Date Of Intro 2020-03-31
Samacsys Manufacturer Micron Micron
JESD-30 Code R-PBGA-B153 R-PBGA-B153
Length 13 mm 13 mm
Memory Density 1099511627776 bit 1099511627776 bit
Memory IC Type FLASH CARD FLASH CARD
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 153 153
Number of Words 137438953472 words 137438953472 words
Number of Words Code 128000000000 128000000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128GX8 128GX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA153,14X14,20 BGA153,14X14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Type NAND TYPE NAND TYPE
Width 11.5 mm 11.5 mm
Base Number Matches 1 1
Rohs Code Yes
Clock Frequency-Max (fCLK) 200 MHz
Data Retention Time-Min 5
JESD-609 Code e1
Peak Reflow Temperature (Cel) 260
Programming Voltage 3.3 V
Screening Level AEC-Q100
Supply Voltage-Nom (Vsup) 3.3 V
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

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Compare MTFC128GAPALBH-AIT with alternatives