MTFC8GAMALNA-AAT
vs
MTFC8GACAEDQ-K1AIT
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
Package Description |
TBGA,
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Factory Lead Time |
18 Weeks
|
|
Date Of Intro |
2018-11-26
|
|
Samacsys Manufacturer |
Micron
|
|
JESD-30 Code |
R-PBGA-B100
|
|
JESD-609 Code |
e1
|
|
Length |
18 mm
|
|
Memory Density |
68719476736 bit
|
|
Memory IC Type |
FLASH CARD
|
FLASH CARD
|
Memory Width |
8
|
|
Number of Functions |
1
|
|
Number of Terminals |
100
|
|
Number of Words |
8589934592 words
|
|
Number of Words Code |
8000000000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
8GX8
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
TBGA
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY, THIN PROFILE
|
|
Parallel/Serial |
PARALLEL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
3.3 V
|
2.7 V
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
2.7 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
14 mm
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare MTFC8GAMALNA-AAT with alternatives
Compare MTFC8GACAEDQ-K1AIT with alternatives