MX0912B251Y,114
vs
MRF1150M
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
Part Package Code |
DFM
|
|
Package Description |
METAL CERAMIC PACKAGE-2
|
|
Pin Count |
2
|
|
Manufacturer Package Code |
SOT439A
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.75
|
|
Additional Feature |
DIFFUSED EMITTER BALLASTING RESISTORS
|
|
Case Connection |
BASE
|
BASE
|
Collector-Emitter Voltage-Max |
20 V
|
|
Configuration |
SINGLE
|
SINGLE
|
Highest Frequency Band |
L BAND
|
L BAND
|
JESD-30 Code |
R-CDFM-F2
|
S-CDFM-F2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
150 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
NPN
|
NPN
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
4
|
Collector Current-Max (IC) |
|
12 A
|
DC Current Gain-Min (hFE) |
|
10
|
Power Dissipation-Max (Abs) |
|
583 W
|
Power Gain-Min (Gp) |
|
7.8 dB
|
|
|
|
Compare MX0912B251Y,114 with alternatives
Compare MRF1150M with alternatives