N82S135N vs AM27S23DC feature comparison

N82S135N Philips Semiconductors

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AM27S23DC AMD

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS ADVANCED MICRO DEVICES INC
Package Description DIP-20 DIP, DIP20,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 45 ns
JESD-30 Code R-PDIP-T20 R-CDIP-T20
JESD-609 Code e0 e0
Memory Density 2048 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Terminals 20 20
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Organization 256X8 256X8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.15 mA 0.16 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 2
Pbfree Code No
Part Package Code DIP
Pin Count 20
Length 24.257 mm
Number of Functions 1
Operating Mode ASYNCHRONOUS
Output Characteristics 3-STATE
Parallel/Serial PARALLEL
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Width 7.62 mm

Compare N82S135N with alternatives

Compare AM27S23DC with alternatives