Part Details for AM27S23DC by AMD
Overview of AM27S23DC by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for AM27S23DC
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 316 |
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RFQ |
Part Details for AM27S23DC
AM27S23DC CAD Models
AM27S23DC Part Data Attributes
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AM27S23DC
AMD
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Datasheet
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AM27S23DC
AMD
OTP ROM, 256X8, 45ns, Bipolar, CDIP20, CERAMIC, DIP-20
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP20,.3 | |
| Pin Count | 20 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 45 ns | |
| JESD-30 Code | R-CDIP-T20 | |
| JESD-609 Code | e0 | |
| Length | 24.257 mm | |
| Memory Density | 2048 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 256X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP20,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.16 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for AM27S23DC
This table gives cross-reference parts and alternative options found for AM27S23DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S23DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27S23PCB | OTP ROM, 256X8, 45ns, Bipolar, PDIP20, PLASTIC, DIP-20 | AMD | AM27S23DC vs AM27S23PCB |
| N82S135NB | IC 256 X 8 OTPROM, 45 ns, PDIP20, Programmable ROM | NXP Semiconductors | AM27S23DC vs N82S135NB |
| 63S280NXXXX | OTP ROM, 256X8, 45ns, CMOS, PDIP20, | Monolithic Memories (RETIRED) | AM27S23DC vs 63S280NXXXX |
| AM27S23DCB | OTP ROM, 256X8, 45ns, Bipolar, CDIP20, CERAMIC, DIP-20 | AMD | AM27S23DC vs AM27S23DCB |
| N82S135N | IC 256 X 8 OTPROM, 45 ns, PDIP20, Programmable ROM | NXP Semiconductors | AM27S23DC vs N82S135N |
| 63S281JXXXX | OTP ROM, 256X8, 45ns, CMOS, CDIP20, | Monolithic Memories (RETIRED) | AM27S23DC vs 63S281JXXXX |
| N82S135N | OTP ROM, 256X8, 45ns, Bipolar, PDIP20 | Signetics | AM27S23DC vs N82S135N |
| AM27S23PC | OTP ROM, 256X8, 45ns, Bipolar, PDIP20, PLASTIC, DIP-20 | AMD | AM27S23DC vs AM27S23PC |
| 63S280JXXXX | OTP ROM, 256X8, 45ns, CMOS, CDIP20, | Monolithic Memories (RETIRED) | AM27S23DC vs 63S280JXXXX |
| 63S280N | OTP ROM, 256X8, 45ns, CMOS, PDIP20, | Monolithic Memories (RETIRED) | AM27S23DC vs 63S280N |