NAND01GW3B2BZA1 vs K9F1G08U0D-SIB00 feature comparison

NAND01GW3B2BZA1 STMicroelectronics

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K9F1G08U0D-SIB00 Samsung Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA TSOP1
Package Description TFBGA, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Pin Count 63 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 35 ns
JESD-30 Code R-PBGA-B63 R-PDSO-G48
JESD-609 Code e0
Length 12 mm 18.4 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 48
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Width 9.5 mm 12 mm
Base Number Matches 3 1
Additional Feature CONTAINS ADDITIONAL 32M BIT NAND FLASH
Type SLC NAND TYPE

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Compare K9F1G08U0D-SIB00 with alternatives