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NC7SP17L6X vs 74LVC2G14GV,125 feature comparison

NC7SP17L6X Fairchild Semiconductor Corporation

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74LVC2G14GV,125 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code MICROPAK MLP TSOP
Package Description 1 MM, ROHS COMPLIANT, MO-252UAAD, MICROPAK-6 PLASTIC, SOT-457, SC-74, TSOP-6
Pin Count 6 6
Manufacturer Package Code 6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED) SOT457
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family P LVC/LCX/Z
JESD-30 Code R-PDSO-N6 R-PDSO-G6
JESD-609 Code e4 e3
Length 1.45 mm 2.9 mm
Load Capacitance (CL) 30 pF
Logic IC Type BUFFER INVERTER
Max I(ol) 0.0005 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 1 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSOP6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 46.3 ns
Propagation Delay (tpd) 46.3 ns 12 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 0.55 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 0.9 V 1.65 V
Supply Voltage-Nom (Vsup) 1.1 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.5 mm
Base Number Matches 3 2
Logic » Gates
Logic » Gates

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