NG80960JF3V25
vs
MC68020CFC25E
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP,
|
QFP, QFP132,1.2SQ
|
Pin Count |
132
|
132
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Intel
|
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
NO
|
Clock Frequency-Max |
25 MHz
|
25 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PQFP-G132
|
S-PQFP-G132
|
Low Power Mode |
YES
|
NO
|
Number of Terminals |
132
|
132
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
25 MHz
|
25 MHz
|
Supply Voltage-Max |
3.45 V
|
5.25 V
|
Supply Voltage-Min |
3.15 V
|
4.75 V
|
Supply Voltage-Nom |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
QUAD
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
ECCN Code |
|
EAR99
|
JESD-609 Code |
|
e0
|
Length |
|
24.13 mm
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Package Equivalence Code |
|
QFP132,1.2SQ
|
Peak Reflow Temperature (Cel) |
|
220
|
Seated Height-Max |
|
4.57 mm
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Pitch |
|
0.635 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
24.13 mm
|
|
|
|
Compare NG80960JF3V25 with alternatives
Compare MC68020CFC25E with alternatives