NVT2002DP
vs
GTL2002GM,125
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP,
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
Also Required Vref(B) Supply 1.8 to 5.5V
|
|
| Delay-Max |
1.5 ns
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
VOLTAGE LEVEL TRANSLATOR
|
|
| JESD-30 Code |
S-PDSO-G8
|
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
2
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Latch or Register |
NONE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
1 V
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
Compare NVT2002DP with alternatives