OMAP3530DCBC72
vs
OMAP3530DCBBE
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
|
| Package Description |
GREEN, PLASTIC, FCBGA-515
|
VFBGA,
|
| Pin Count |
515
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
26
|
15
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
59 MHz
|
38.4 MHz
|
| External Data Bus Width |
16
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B515
|
S-PBGA-B515
|
| Length |
14 mm
|
12 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
515
|
515
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA515,26X26,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
0.9 mm
|
| Speed |
720 MHz
|
600 MHz
|
| Supply Voltage-Max |
1.89 V
|
|
| Supply Voltage-Min |
1.71 V
|
|
| Supply Voltage-Nom |
1.8 V
|
1.15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare OMAP3530DCBC72 with alternatives
Compare OMAP3530DCBBE with alternatives