P80C32X2BBD
vs
TSC87C52-16ABR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ATMEL CORP
|
| Part Package Code |
QFP
|
LCC
|
| Package Description |
LQFP, QFP44,.47SQ,32
|
QCCJ,
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
|
| Additional Feature |
ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ
|
|
| Address Bus Width |
16
|
|
| Bit Size |
8
|
|
| CPU Family |
8051
|
|
| Clock Frequency-Max |
33 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQFP-G44
|
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of I/O Lines |
32
|
|
| Number of Terminals |
44
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LQFP
|
|
| Package Equivalence Code |
QFP44,.47SQ,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, LOW PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
256
|
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
33 MHz
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare P80C32X2BBD with alternatives
Compare TSC87C52-16ABR with alternatives