PESD5V0V4UF,115
vs
UCLAMP0544P.TCT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SEMTECH CORP
|
| Part Package Code |
SON
|
DFN
|
| Package Description |
1 X 1.45 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SMD, 6 PIN
|
R-PDSO-N10
|
| Pin Count |
6
|
10
|
| Manufacturer Package Code |
SOT886
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
SEMTECH
|
| Breakdown Voltage-Max |
7.2 V
|
8.5 V
|
| Breakdown Voltage-Min |
6.4 V
|
6 V
|
| Breakdown Voltage-Nom |
6.8 V
|
7.1 V
|
| Clamping Voltage-Max |
13 V
|
12.5 V
|
| Configuration |
COMMON ANODE, 4 ELEMENTS
|
COMMON ANODE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
MO-252
|
|
| JESD-30 Code |
R-PBCC-N6
|
R-PDSO-N10
|
| JESD-609 Code |
e3
|
e4
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Peak Rev Power Dis-Max |
16 W
|
25 W
|
| Number of Elements |
4
|
4
|
| Number of Terminals |
6
|
10
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
LOW CAPACITANCE
|
| Operating Temperature-Min |
|
-55 °C
|
|
|
|
Compare PESD5V0V4UF,115 with alternatives
Compare UCLAMP0544P.TCT with alternatives