PF48F4400P0VBQ0
vs
M30L0T8000T2ZAQF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
NUMONYX
|
| Package Description |
8 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-88
|
8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
88 ns
|
85 ns
|
| Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
|
| Boot Block |
BOTTOM
|
TOP
|
| JESD-30 Code |
R-PBGA-B88
|
R-PBGA-B88
|
| Length |
10 mm
|
10 mm
|
| Memory Density |
536870912 bit
|
268435456 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
88
|
88
|
| Number of Words |
33554432 words
|
16777216 words
|
| Number of Words Code |
32000000
|
16000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Organization |
32MX16
|
16MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
1.8 V
|
1.8 V
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
88
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare PF48F4400P0VBQ0 with alternatives
Compare M30L0T8000T2ZAQF with alternatives