PMEG3050EP,115
vs
PMEG6020ER
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOD
|
|
Pin Count |
2
|
2
|
Manufacturer Package Code |
SOD128
|
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.80
|
8541.10.00.50
|
Samacsys Manufacturer |
Nexperia
|
NXP
|
Application |
EFFICIENCY
|
EFFICIENCY
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F2
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Non-rep Pk Forward Current-Max |
70 A
|
50 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Output Current-Max |
5 A
|
2 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power Dissipation-Max |
0.625 W
|
1.8 W
|
Reference Standard |
IEC-60134
|
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
TIN
|
Tin (Sn)
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
2
|
Package Description |
|
PLASTIC, SMD, 2 PIN
|
Qualification Status |
|
Not Qualified
|
|
|
|
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