RCS2012F5362CS vs MC0.1W08051%53K6 feature comparison

RCS2012F5362CS Samsung Electro-Mechanics

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MC0.1W08051%53K6 SPC Multicomp

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer SAMSUNG ELECTRO-MECHANICS SPC TECHNOLOGY/ MULTICOMP
Package Description CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Factory Lead Time 24 Weeks
Additional Feature ANTI-SULFUR
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 2 mm 2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, PUNCHED PAPER, 7 INCH
Rated Power Dissipation (P) 0.125 W 0.1 W
Rated Temperature 70 °C
Resistance 53600 Ω 53600 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 1 1
Series MC(0805)THICK-FILM

Compare RCS2012F5362CS with alternatives

Compare MC0.1W08051%53K6 with alternatives